TY - JOUR AU - Krechun, M.M. PY - 2019/04/01 Y2 - 2024/03/29 TI - Galvanic interconnects for thermoelectric cooling modules: Array JF - Physics and Chemistry of Solid State JA - Phys. Chem. Sol. State VL - 20 IS - 1 SE - Review DO - 10.15330/pcss.20.1.88 UR - https://journals.pnu.edu.ua/index.php/pcss/article/view/103 SP - 83-88 AB - <p>The paper studies the use of galvanic technologies in thermoelectricity. The technological features of applying anti-diffusion coatings on bismuth telluride based thermoelectric material (TEM) by electroplating method are considered. The advantages and disadvantages of the properties of anti-diffusion structures obtained by the electrochemical method are determined.</p> ER -