Galvanic interconnects for thermoelectric cooling modules
DOI:
https://doi.org/10.15330/pcss.20.1.88Keywords:
thermoelectric material, thermoelement legs, anti-diffusion layers, galvanic interconnectsAbstract
The paper studies the use of galvanic technologies in thermoelectricity. The technological features of applying anti-diffusion coatings on bismuth telluride based thermoelectric material (TEM) by electroplating method are considered. The advantages and disadvantages of the properties of anti-diffusion structures obtained by the electrochemical method are determined.
References
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[2] B. M. Goltsman, V. A. Kudinov, I. A. Smirnov, Semiconductor thermoelectric materials based on Bi2Te3 (Nauka, Moscow, 1972).
[3] О. О. Novomlynets, I. V. Zavalna, E. V. Polovetskyi, Bulletin of Chernihiv Technological University. Engineering sciences 4(69), 82 (2013).
[4] A. А. Ashcheulov, I. S. Dobrovolsky, I. S. Romaniuk, F. D. Fotiy, Prikladnaiia fizika – Plasma Physics Reports, 1, 85 (2018).
[5] E. A. Kolenko, Thermoelectric cooling devices (Nauka, Leningrad, 1967).
[6] E. N. Nikitin, V. I. Tarasov, Certificate of Authorship 36739. Method of interconnecting thermoelements. (1972).
[7] A. A. Ashcheulov, I. S. Romaniuk, J.Thermoelectricity 3, 70 (2004).
[8] Patent US3279955 Edvin J. Miller Dennis O'Hora. Method of forming electroplated thermoelectric junction and resultant article (1966).
[9] Patent of Ukraine 81556. Anatychuk L. I., Antoniuk E. I., Luste I. J., Razinkov V. V. Thermoelement (2008).
[10] USSR Patent 361748. Dimant A. B., Syrkin V. G., et al. Method of obtaining anti-diffusion barrier (1978).
[11] Patent of Russian Federation 2245593. Kiparisov S. Ya. Method of interconnecting thermoelements (2005).
[12] E. P. Sabo, J.Thermoelectricity 1, 27 (2011).
[13] Patent US3396454. James P. Method of forming ohmic contacts in semiconductor devices (1964).
[14] Patent US5429680. James P. Thermoelectric heat pump (1995).
[15] Patent US 3249470A. Naake Hans J. Method of joining thermoelectric elements and thermocouple (1962).
[16] Patent of Russian Federation 2293399. Osvenskyi V. B., Malkova N. V. Method of creating anti-diffusion barrier on the surface of thermoelectric material plates (2007).
[17] Patent of Ukraine 108561. Antoniuk V. V., Skrypskyi I. M., Slipeniuk O. T. (2016). Method of applying anti-diffusion barrier on the surface of thermoelectric material (2016).
[18] V. M. Fedosiuk, Nanostructured films and nanowires (Belarusian State University, Minsk, 2006).
[19] Patent of Ukraine 111517. Antoniuk V. V., Skrypskyi I. M. Electrolyte for electroplating of antimony films (2016).
[20] N. N. Proshkin, Tekhnologiia i konstruirovaniie v elektronnoi apparature 2-3, 48 (2000).
[21] Certificate of Authorship №1538542. Peskov V. A., Proshkin N. N. Composition for application of nickel coatings (1988).
[22] V. V. Antoniuk, I. M. Skrypskyi, J. Thermoelectricity 1, 72 (2016).
[23] Patent of Ukraine 107921. Antoniuk V. V., Skrypskyi I. M. Nickel plating electrolytes (2016).
[24] Patent of Ukraine 116269. Antoniuk V. V., Skrypskyi I. M., Slipeniuk O. T., Krechun M. M. Multilayer anti-diffusion structure (2017).
[25] Patent of Ukraine UA 79960. Mykhailovsky V. Ya., Mocherniuk R. M., et al. Method of manufacturing thermoelectric element comprising n-In4Se3 (2013).
[26] Certificate of Authorship № 918996. Pomazanov I. N., Rachkov V. A., et al. Method of connecting thermoelements (1982).
[27] Patent of Ukraine 123764. Antoniuk V. V., Skrypskyi I. M., Slipeniuk O. T., Krechun M. M. Method of forming anti-diffusion barrier layer on interconnecting plates (2018).
[28] A. D. Finogenov, Galvanic method of interconnecting thermoelements. In: Proc. of I and II conferences on thermoelectricity (Moscow-Leningrad: AN SSSR, 1963).
[29] Patent of Russian Federation 2511274. Belov Yu. M. Thermoelectric module (2014).
[30] Patent of Russian Federation 2515128. Grishin V. I. Method of manufacturing semiconductor legs for thermoelectric module and a thermoelectric module (2014).
[31] Patent of Russian Federation 2537096. Grishin V. I. Thermoelectric module (options) (2014).
[32] Patent of Russian Federation 2425434. Bashkov V. M., Belyaieva A. O., et al. Method of manufacturing thermoelectric module with increased service life (2011).
[33] Patent of Russian Federation 2433506. Schulz-Harder Juergen. Method of manufacturing Peltier modules, as well as Peltier module (2011).
[34] C. Jiang, X. Fan, Z. Rong, C. Zhang, G. Li, B. Feng, J.Hu, Q. Xiang. J, Electronic Materials 10, 1007 (2016) (doi:10.1007/s11664-016-5135-8).
[35] Y.-C. Tseng, H. Lee, N. Y. H., S.-P. Feng, C.-M. Chen. J, Electronic Materials 10, 1007 (2017) (doi:10.1007/s11664-017-5777-1).
[36] Y. C. Lan, D. Z. Wang, G. Chen, and Z. F. Ren, Applied Physics Letters 92, 101910 (2008) (doi.org/10.1063/1.2896310).
[37] Patent of Ukraine № 81334. Anatychuk L. I. Thermoelectric module (2007).
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Published
2019-04-01
How to Cite
Krechun, M. (2019). Galvanic interconnects for thermoelectric cooling modules. Physics and Chemistry of Solid State, 20(1), 83–88. https://doi.org/10.15330/pcss.20.1.88
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