Physico-chemical Processes at the Interface of Heterostructures Ag-Pd – Sn-Pb
Physicochemical processes taking place at the interface of film elements (conductors) of hybrid integrated circuits, thick-film sensors and other microelectronic devices (MED) based on silver-palladium pastes and elements of standard soldering materials have been studied. Physicochemical mechanisms of processes of the material element mutual dissolution at the interface are proposed and analyzed. Conclusions are made that these processes affect the degradation of the electrophysical parameters and contact switch connections operational characteristics. It is established that the degradation main cause (partial or complete destruction of the contact connections on substrate ceramics (glass) Ag-Pd – Sn-Pb) is the functional film material significant dissolution in the Sn-Pb melt.
V. Alexiades, A.D. Solomon, Mathematical Modeling of Melting and Freezing Processes.
(Hemisphere Publ. Co, Washington Philadelphia London) DC, 1993); http://www.math.utk.edu/~vasili/475/Handouts/3.PhChgbk.1+title.p
E. Javierre-Pérez, Delft University of Technology, Delf, 94 (2003); (https://repository.tudelft.nl/islandora/object/uuid%3A3d85f613-a528-4710-8e0c-cbfb7ed15e67) .
J. Caldwell, Y.Y. Kwan, Commun. Numer. Meth. Engng. 20, 535 (2004); https://doi.org/10.1002/cnm.691.
N.A. Krasnoshlyk, A.O. Bogatyryov, Visnik of the Cherkasy University. Series
“Applied Mathematics. Informatics", 194, 16 (2011); https://scholar.google.com/scholar?cluster=2653120927709812469&hl=en&oi=scholarr.
Ya.I. Lepikh, T.I. Lavrenova, Abstract book of XVII International Freik Conference on physics and technology of thin films and nanosystems ICPTTFN-XVII, Ivano-Frankivsk, 57 (2019); https://conference.pu.if.ua/phys_che/start/conference_17/zbirn_%202019_internet.pdf.
Ya.I. Lepikh, T.I. Lavrenova, N.M. Sadova, Journal of nano- and electronic physics,Sumy State University 9(5), 4 (2017); https://doi.org/10.21272/jnep.9(5).05005.