Short comparative analysis on the prospects for the use of three-dimensional FIN FET transistors for sensor electronics
DOI:
https://doi.org/10.15330/pcss.26.3.473-479Keywords:
sensor electronics, nanometer structures , silicon nanowires, FinFETAbstract
The development of modern electronics is based on the introduction of modern micro- and nanoelectronic technologies. Traditional complementary metal-oxide-semiconductor (CMOS) planar transistor structures based on bulk silicon are gradually giving way to more advanced structures with better electrical, frequency, energy characteristics, and radiation resistance based on three-dimensional (3D) "silicon-on-insulator" structures that provide better electrical characteristics, higher speed, energy efficiency with the possibility of further scaling. Promising areas of use for both traditional microcircuits and sensor electronics are the use of 3D nanometer transistors of the FinFET, Gate-All-Around (GAA) type, as well as those based on nanosheets (Nano-sheet) and nanowires (Nanowire). The paper considers the structures of such types of SOI nanometer 3D transistors and examples of their use in sensor electronics.
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